The consulting services are provided by an experienced electronics and electro-mechanics engineer with a robust background in the design, development, manufacturing and testing of analog and digital electronic circuits, enclosures, and systems. Specializes in PCB and PCA technologies for industrial, medical, communication, automotive, defense, aerospace and high reliability and availability mission-critical applications, with deep knowledge of industry standards, materials, and processes, coupled with expertise in conflict materials management, risk management and DFMA&T.
Areas of Consulting
Electronic Design
Selection of electrical, electro-mechanical, and electronic (EEE) components
Selection basic materials. The selection of components and materials is made considering, not only the functional and parametric compatibility with the design requirements but also considering their direct impact on the final product reliability and the existence of potential risks, like tin whiskers grow, soldering materials and processes compatibility, solder joints reliability, moisture sensitivity, cleaning solvents and processes compatibility, thermal compatibility, source and counterfeiting avoidance.
Detailed design review, including the completion and final selection of components and materials and the application of DFMA&T design rules.
Printed circuit board (PCB) design and layout
PCB type selection: Multilayer Rigid, Flexible, Flex-Rigid, High Speed/High Frequency, High power, HDI, Sequential Lamination, Any-layer via, VIPPO, Via protection (filling, capping, wrap). Embedded Components.
PCB stack-up design, including number of layers, power reference planes and controlled impedance signals.
Selection of Printed Circuit Board Raw and Base Materials (Laminates (rigid and flex), Prepregs, Cooper type, Adhesives, Coverlay and Solder resist).
Selection and specification of Printed Circuit Boards plating and finishes, materials and processes, lead and lead free.
Quality standard and level determination: IPC (classes 2, 3, 3A/XS), ESA. NASA, etc.
Components library characterization and design, including symbols, geometries, footprints, and solder paste stencil parameters.
PCB layout, placement and routing and Gerber files generation
PCB production instructions and general notes, attached to the production drawings.
PCB design review and approval.
Printed Circuit Board manufacturing
Selection of the most suitable PCB manufacturer, qualified for the required quality standard and level.
Definition and selection of processes materials.
Verification of Process Control Management through Statistical Process Control (SPC).
In process and final tests and inspection.
Review and approval of manufacturer final test report – COC acceptance.
Definition and performance of additional test methods and procedures for PCB reliability demonstration, including PCB cross-sections, IST, HATS/PCQR2, CAF resistance, THB, thermal shock, etc., as well as design and production of the necessary test specimens and coupons.
Printed Circuit Boards Assembly (PCA)
Incoming inspection and proper storage of EEE components, PCBs, process materials and basic materials.
Soldering Profile settings and optimization.
Cleaning and drying/ baking of components, PCBs and PCAs.
De-golding, re-balling and re-plating of electronic Components terminations.
Components leads trimming and forming.
Soldering processes: wave, selective wave, reflow (convection and vapor phase) leaded and lead-free.
Soldering materials: high and low melting temperatures, tin based, indium based, binary, ternary and quaternary alloys.
Potting and Conformal Coatings.
Rework and Repair.
Assembly Reliability and ESD control.
Assembly final tests and inspection: ICT, Flying Probes, Functional, JTAG-Boundary Scan, visual (X-RAY and optic) tests.
Enclosure integration and tests
PCA verification and validation (stand-alone).
Empty enclosure power and interface tests.
PCAs integration into the enclosure.
Enclosure verification and validation, including environmental tests.
